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| News > Industry News |
| Rise in price notice to fly everywhere, urge the telephone to fight ceaselessly! A summary of a new round of components |
| Time： 2018-06-20 |
In 2016, in fact, everyone has been tossed about enough. In 2017, I didn't expect the situation to be worse. The price announcement was flying everywhere, and the phone was not stopped. China's Manufacturing Purchasing Managers Index has been standing on the top of the ups and downs line for 11 consecutive months, with strong domestic demand and good overseas exports, and manufacturers are generally busy. In general, in the second half of the year, the order is better than the first half of the year. The manufacturer has to start making dumplings. How will all kinds of raw materials, all kinds of components, and all kinds of IC materials be deductive? Exclusive international electronic business arrangement, the second half of 2017 a new round of raw materials &IC market summary.
Summary of resistance, capacity, power, CIS, wafer, flash
Resistance capacity
The passive component is the most basic electronic material in the electronic manufacturing industry. The annual use volume is more than trillion, the price is cheap, the amount of material is large and the general type is most. It belongs to the niche market, the price fluctuation is low, the customer concentration is high, and it has long been forgotten by the market. However, due to the characteristics of light, thin, short and small consumer electronics products, the rise of micro components has led to the gradual entry of passive components into the business cycle.
The passive components in Japan, Korea, Taiwan and other passive components are still not out of stock this year, which is not helpful to improve the shortage. It is expected that the passive components will be out of stock at the end of the year at the end of the year at the supply side, because the supply side is insufficient, the delivery of new orders and new customers is over 20 weeks, which is the last few years. The longest time.
After the giant, Hua Xinke and other manufacturers announced second price rises, the MLCC spot price rose sharply. Under the expected psychology of the shortage in the prosperous quarter, the customers began to pick up the goods in the spot market, and some of the specifications were even higher than the contract price.
Affected by the R-Chip capacity problem, Rom's fixed resistors and resistance network products are out of stock. The tantalum capacitor part is extended and the ceramic capacitor part is extended.
AVX factory has been on strike, capacity is limited, another factory capacity is also not up, ROHM capacity is booking by car. The MnO2 tantalum capacitor is on the rise. Orders and goods on hand should be as large as memory. Although MLCC and polymer can be substituted, some high capacity products will still consider the cost reasons and continue to use Mno2 tantalum capacitors.
The main manufacturers of global passive components: KEMET, Vishay, Johnson (Johanson), Venkel, ATCeramics, Syfer; Japanese village, KYOCERA, pill and pill, TDK, Rom, sun lure, GUI Gong, NIC, Panasonic, Rubycon, Nigicon; Korea SamSung mechatronics, three, and Taiwan Guo giant, Hua Xin The famous people in the mainland are Yu Yang, Shun Luo, Fenghua high school, three ring, torch electronics, Dali kip, Hongkong AVX and so on.
power
Power and power devices are the key to extending battery life in portable devices, wireless systems and new energy vehicles, and will show strong market growth. Power devices (Mosfet, IGBT, IPM), current converter, diode and so on, the price has been rising many times, the original plant has also been extended, the global scope, still can not be improved.
In terms of light-emitting diodes, the shortage of CML transistors is more serious, and prices are rising. Some of the original delivery dates are extended from 6-8 weeks to 10 weeks. ROHM, Infineon, TI and other original plants give priority to IGBT, resulting in IPM production capacity conservatism and shortages. Part of NXP's ESD devices are out of stock for over 26 weeks.
European and American days: IR, TI, Fei Zhao, renesa, Italian semiconductor, ADI, Toshiba, Vishay, ABB, AOS, NJI Pu, IXYS, Rom, Fuji motor, Danfoss, Starpower, MITSUBISHI motor, Microsemi, NXP.
Taiwan: UTC (You Shun), CET (Huarui joint-stock company), ANPEC (Mao Da), NIKO-SEMI (Nixon micro); Mainland: CRRC, BYD microelectronics, Guangyu Rui core, core microelectronics, Leshan wireless, Weil semiconductor, Shanghai advanced and so on.
The domestic IGBT has a long way to go. With China and Malaysia's generation, the number of enterprises made and sold by power MOSFET will increase, and the price of devices will decline gradually.
CIS
Since apple iPhone7 drive dual camera design popular, HUAWEI, Jinli, millet, OPPO, VIVO and other big shipping giant high-end machines to use double camera selling point, formally become the Android high-end flagship standard, and further to the middle market. In the second half of the year, Samsung will also carry double cameras on NOTE 8 to counterbalance iPhone 8. ZTE, Lenovo, and ODM independent brands will also launch a double cell phone to enter the overseas market.
Such a huge market demand will directly detonate the CMOS image sensor and the supply chain of the related module. In the second half of the year, the CIS (mobile camera sensor) component will be swept away and hot. Especially the CIS above 5M has been in tight supply situation, and CIS will inevitably usher in a new round of shortage.
The prices of wafer and packaging materials have gone up, Fab overall capacity is insufficient, fingerprint IC and power management IC take up capacity, price pressure and lower production costs will be the biggest challenge for domestic image sensor manufacturers in the second half of the year.
Major manufacturers: SONY (Toshiba), Samsung, SK helix, Beijing Howe, SiC, geo micro, A Morimi (Aptina), BYD micro, Ruxin micro, German code, Italian semiconductor, Infineon, wonders and so on; double camera module factory: Ou Feiguang, Shun Yu, Qiu Ti, Xinli, Hsin Li Tai, LG Innotek, Guang Bao, BYD electronics, Foxconn and so on.
Wafer
In the near future, the price effect of the whole silicon wafer industry is moving rapidly from 12 inches.
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